Automotive Cybersecurity HW System Engineer

at Qualcomm
Published November 29, 2022
Location San Diego, CA
Category Default  
Job Type Full-time  

Description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Systems Engineering

General Summary:

PRINCIPAL DUTIES AND RESPONSIBILITIES:

The individual will work in a new group of driving Automotive Cybersecurity and implementation of customer expectations, defining the Automotive Cybersecurity processes and collateral, customer interfacing, from project conception, Security Architecture definition, and implementation. He/She/They will define of the new ISO21434 Automotive Cybersecurity standard and processes across multiple teams within Qualcomm as well as work with suppliers, 3rd party IP vendors and customers to ensure common understanding and requirements are defined and met.

Oversees and drives following activities but not limited

* Work closely with Auto Cybersecurity PE to develop Automotive Cybersecurity process and standards for Automotive SoCs

* Define and Development processes of Cybersecurity standards such as ISO21434

* Develop cybersecurity audit process for HW IPs in Automotive SoCs

* Works as a Cybersecurity domain expert for Automotive SoCs

* Trains IP teams to adopt and implement Cybersecurity standards and processes

* Drives audit of standards and their implementation, works with 3rd party audit teams if needed

* Work with System Engineer, PM, PdM teams to prioritize activities and collateral delivery

* Create customer facing documentation and deliverables

* Work on Customer facing tasks and activities with Cybersecurity PE

COMPETENCIES:

* Semiconductor IP development and/or SoC Architecture definition

* Security expertise and experience with IP and SoC development

* Excellent documentation and communication skills

* Knowledge of IP Development, Definition, Design development and validation

* Experience leading diverse teams with a variety of expertise via influence management

* Knowledge of design, IP, design tools, Security Methodology, packaging, modules and / or System in Packages (SiP) is a plus.

* Safety Threat Analyses as well as methods to minimize Security implementation impacts and provide high quality products is a plus

* Understanding and willingness to learn the Automotive Ecosystem. Will need to develop appreciation of Automotive Cybersecurity requirements, SW / OS, operating environments and ecosystem

Preferred Skills:

* Minimum of 8 years of Industry experience, 10 years preferred

* 5+ years of technical security leadership experience in an area of product development.

* Master or PHD degree in Engineering, Information Systems, Computer Science, or related field.

* Solid understanding of Security ecosystem, specifications, quality and product requirements

* Knowledge of vehicle networks, communication protocol and diagnostics

* Hands on experience with HW security, circuit diagrams, ICs, IP development, SW/HW interactions and product development flow

* Demonstrated skills in managing complex design projects in partnership with both internal and external groups

* Excellent written and verbal communications skills are essential.

Physical Requirements

* Frequently transports between offices, buildings, and campuses up to ½ mile.
* Frequently transports and installs equipment up to 5 lbs.
* Performs required tasks at various heights (e.g., standing or sitting).
* Monitors and utilizes computers and test equipment for more than 6 hours a day.
* Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.

Minimum Qualifications:

We are looking for an Automotive Cybersecurity HW System Engineer to define process, methodology and standards for Automotive Hardware across IVI (In-Vehicle Infotainment), ADAS and Autonomous driving, and Telematics. An Automotive chipset comprises multiple chips that together perform the functions desired (such as Application Processor, PMICs, SIP Modules, Connectivity chips) and associated Software/Firmware.

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